Advantages of grinding and grinding

After the customized metal cutting disc is used, the surface of the diced silicon wafer has a certain degree of damage and deformation, and since the precision of the feeding of the microtome is limited, the thickness of the silicon wafer is dispersed, so that the grinding is necessary after the dicing.
Grinding the silicon wafer essentially causes the silicon surface to constantly rub against the abrasive under a certain pressure, and removes the damage layer on the surface of the silicon wafer by mechanical grinding. The measurement is generally about 60P, and the silicon wafer is produced when cutting. About 50 u after injury. By studying the silicon wafer, it is more uniform than the cutting and reaches a predetermined thickness. Therefore, the selection of a suitable motion form and the use of a suitable abrasive can improve the quality of the polishing sheet.
In addition to abrasives, a suitable abrasive ratio is also critical. Abrasive size and particle size all affect the surface roughness.
The workpiece is cut by a grinding disc on a grinding machine to meet the requirements of the drawing in terms of shape, dimensional accuracy, and surface roughness. This processing method is called grinding processing.
There are many ways to grind the grinding price, including foreign aid grinding, internal grinding, surface grinding, thread grinding, gear grinding, centerless foreign aid grinding and profile grinding. If the surface of the workpiece is divided into several parts, it can be divided into three types: peripheral grinding, end grinding and profile grinding.
The main features of grinding compared with other cutting methods such as turning and planning are:
1, can get high dimensional accuracy and good surface roughness.
2, a wide range of processing, such as foreign aid, inner hole, plane, thread, gear, molding surface, rail surface, various cutting tools, and steel cutting.

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