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Stainless steel special grinding sheet advantage

In the conventional industry, the polishing technique is a process of cutting the surface of a metal part by means of the rotation of a customized metal cutting disc to which the abrasive adheres. With the development of the industry, grinding technology is also constantly improving. When the traditional cutting piece is polished in stainless steel, the grinding will not deteriorate, but the red part on the surface will be deteriorated. If the original color is restored after polishing, it will not deteriorate, because the deterioration has been worn away. However, in the polishing, our operators should also pay attention to the fact that the intergranular body of the cutting piece will definitely change, that is, the bending or the tube will cause the intergranular body to be misaligned, which is only slight and will not seriously change the material. If there is a phenomenon of sharpening the transition, it will lead to a change in the composition of the tempering.
The stainless steel cutting piece contains less than 18% ferritic stainless steel, which has good cutting performance because its structure is slightly brittle and the chips are easily broken. In terms of machinability, these steels are attributed to low carbon martensitic stainless steels. Stainless steel cutting sheets are difficult to cut because they are vicious and have long chips, and these steel grades are similar to cutting austenitic stainless steels.
After the dicing sheet is used, the surface of the diced silicon wafer has a certain degree of damage and deformation, and since the precision of the feeding of the microtome is limited, the thickness of the silicon wafer is dispersed, so that the grinding is necessary after the dicing.
Grinding the silicon wafer essentially causes the silicon surface to constantly rub against the abrasive under a certain pressure, and removes the damage layer on the surface of the silicon wafer by mechanical grinding. The measurement is generally about 60P, and the silicon wafer is produced when cutting. About 50 u after injury. By studying the silicon wafer, it is more uniform than the cutting and reaches a predetermined thickness. Therefore, the selection of a suitable motion form and the use of a suitable abrasive can improve the quality of the polishing sheet.
In addition to abrasives, a suitable abrasive ratio is also critical. Abrasive size and particle size all affect the surface roughness.

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